The global Semiconductor Epoxy Molding Compound market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The USA market for Global Semiconductor Epoxy Molding Compound market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
The China market for Global Semiconductor Epoxy Molding Compound market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
The Europe market for Global Semiconductor Epoxy Molding Compound market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
The U.S. Market is Estimated at $ Million in 2023, While China is Forecast to Reach $ Million.
Bulk Molding Compounds Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Epoxy Molding Compound include Hitachi Chemical, Sumitomo Bakelite Company, Panasonic, Kyocera, Samsung SDI, KCC Corporation, Chang Chun Group, Hysol Huawei Electronics and Nepes, etc. in 2023, the global top five players have a share approximately % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Epoxy Molding Compound, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Epoxy Molding Compound. This report contains market size and forecasts of Semiconductor Epoxy Molding Compound in global, including the following market information:
- Global Semiconductor Epoxy Molding Compound Market Revenue, 2019-2024, 2025-2030, ($ millions)
- Global Semiconductor Epoxy Molding Compound Market Sales, 2019-2024, 2025-2030, (Kiloton)
- Global top five Semiconductor Epoxy Molding Compound companies in 2023 (%)
We surveyed the Semiconductor Epoxy Molding Compound manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Epoxy Molding Compound Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (Kiloton)
Global Semiconductor Epoxy Molding Compound Market Segment Percentages, by Type, 2023 (%)
- Bulk Molding Compounds
- Sheet Molding Compounds
Global Semiconductor Epoxy Molding Compound Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (Kiloton)
Global Semiconductor Epoxy Molding Compound Market Segment Percentages, by Application, 2023 (%)
- Semiconductor Packaging
- Electronic Component
- Others
Global Semiconductor Epoxy Molding Compound Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (Kiloton)
Global Semiconductor Epoxy Molding Compound Market Segment Percentages, By Region and Country, 2023 (%)
- North America (United States, Canada, Mexico)
- Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
- Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
- The Middle East and Africa (Middle East, Africa)
- South and Central America (Brazil, Argentina, Rest of SCA)
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Semiconductor Epoxy Molding Compound revenues in global market, 2019-2024 (Estimated), ($ millions)
- Key companies Semiconductor Epoxy Molding Compound revenues share in global market, 2023 (%)
- Key companies Semiconductor Epoxy Molding Compound sales in global market, 2019-2024 (Estimated), (Kiloton)
- Key companies Semiconductor Epoxy Molding Compound sales share in global market, 2023 (%)
Further, the report presents profiles of competitors in the market, key players include:
- Hitachi Chemical
- Sumitomo Bakelite Company
- Panasonic
- Kyocera
- Samsung SDI
- KCC Corporation
- Chang Chun Group
- Hysol Huawei Electronics
- Nepes
- PhiChem Materials
- Jiangsu Zhongpeng New Material
- Shin-Etsu Chemical
- CAPLINQ Corporation
- Scienchem
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Epoxy Molding Compound, market overview.
Chapter 2: Global Semiconductor Epoxy Molding Compound market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Epoxy Molding Compound manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Epoxy Molding Compound in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Epoxy Molding Compound capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
Table of content
1 Introduction to Research & Analysis Reports
1.1 Semiconductor Epoxy Molding Compound Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Semiconductor Epoxy Molding Compound Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Semiconductor Epoxy Molding Compound Overall Market Size
2.1 Global Semiconductor Epoxy Molding Compound Market Size: 2023 VS 2030
2.2 Global Semiconductor Epoxy Molding Compound Revenue, Prospects & Forecasts: 2019-2030
2.3 Global Semiconductor Epoxy Molding Compound Sales: 2019-2030
3 Company Landscape
3.1 Top Semiconductor Epoxy Molding Compound Players in Global Market
3.2 Top Global Semiconductor Epoxy Molding Compound Companies Ranked by Revenue
3.3 Global Semiconductor Epoxy Molding Compound Revenue by Companies
3.4 Global Semiconductor Epoxy Molding Compound Sales by Companies
3.5 Global Semiconductor Epoxy Molding Compound Price by Manufacturer (2019-2024)
3.6 Top 3 and Top 5 Semiconductor Epoxy Molding Compound Companies in Global Market, by Revenue in 2023
3.7 Global Manufacturers Semiconductor Epoxy Molding Compound Product Type
3.8 Tier 1, Tier 2 and Tier 3 Semiconductor Epoxy Molding Compound Players in Globa
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